Plasmas froids BOMBARDMENT TEM Spectroscopic ellipsometry Structure Atomic layer etching Biocapteurs B2 Semiconducting indium compounds Bixbyite A-CNx Transfert d'énergie Vanadium Sesquioxide Alzheimer's disease SF 6 Argon InP chlorine etching inductive coupled plasma ICP modeling plasma sheath simulation Plasma etching Rutile Nanotubes Carbon Nanotube Sputtering CNTs’ collapse Adsorption Copper Aluminium nitride Kirkendall effect Atomic force microscopy Calcined clay Anatase Thin films Scanning electron microscopy Optical properties XPS Sol-gel Functionalization Titanium dioxide Oxides Selenization NEXAFS Avalanche breakdown Semiconductors Chalcogenide A Multilayers Resistive switching Etching Capacitance Transmission electron microscopy Non-volatile memory Biofilms microbiens CHLORINE PLASMAS Bipolar resistive switching BRS B3 Solar cells A Thin films Mott insulators A1 Characterization Colloidal solution CaTiO3Pr^3^+ B Chemical synthesis Biomasse Applications industrielles B2 Quaternary Band alignment A3 Physical vapor deposition processes Residual stress Carbon 3 nm in size Annealing Optical interferometry B1 Inorganic compounds PECVD V2O3 Nanocomposite B2 Semiconducting alloys Amyloid precursor Films TiO2 Aryl-diazonium salts AlN Ambipolar material C Photoelectron spectroscopy CIGSe Amorphous Integrated optics Thin film Low-pressure plasma processing Ablation laser Alloying Mass spectrometry Mott insulator AZO thin films AuCu alloy CH4 A Chalcogenides Magnetron sputtering Buffer Couple Physical vapor deposition Optical waveguides X-ray diffraction Biomembranes Band gap X-ray photoelectron spectroscopy